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Semiconductor Systems

Packaging Metrology System

The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision.

Powerful Performance
Coherence Scanning Interferometry (CSI) is the measurement technology at the core of the APM650 system.

This non-contact technique provides high-precision, and high-value surface metrology benefits including:

• Measures virtually all types of surfaces, from rough to super smooth, including thin films, steep slopes, and large steps.
• Sub-nanometer measurement precision is independent of field magnification
• Gage capable performance - exceptional precision and repeatability for the most demanding production applications.
• SureScan™ vibration tolerance technology - robust operation in virtually any environment.
• Mx™ software enables seamless data exchange with other ZYGO Profilers including ZeGage, NewView 8000, and Nexview.